Equipment

Description:

Information

	X-RAY Function: By combining micro-focus X-ray tubes and flat panel digital detector, it is possible through non-observation of subtle defects inside the semiconductor nondestructive inspection method is also used to measure the size, BGA bubble rate, the area ratio of the curvature of wire and other related parameters. Mainly used for failure analysis.
	SAT Function: the use of acoustic microscopy imaging (AMI) on the internal structure of a semiconductor defect qualitative analysis is mainly used for online monitoring and failure analysis of layered products.
	HTST Features: high temperature storage test (HTST), temperature range: room temperature ~ 400 ℃, mainly used for HTST assessment.
	THT Features: high temperature and humidity test (THT), temperature range: room temperature ~ 150 ℃, humidity range: 30% ~ 98% RH. Mainly used for THT assessment.
	PCT Function: High pressure cooker test (PCT), temperature range: room temperature ~ 125 ℃, mainly used for PCT examination.
	REFLOW Function: Analog SMT components soldering technology, mainly used for failure analysis.